PubMed: Development of High Strength Particleboards from Hemp Shives and Corn Starch
Materials (Basel). 2023 Jul 14;16(14):5003. doi: 10.3390/ma16145003.
In the current study, high-strength boards for the construction industry were developed from renewable natural resources, fibrous hemp shives, and corn starch. During the research, the influence of the composition of the mixture, the processing of raw materials, and technological parameters on the operational properties of the board were evaluated. The influence of the binding material and the water content on the properties of the molded boards was evaluated. It was established that the rational amount of starch is 15% of the mass of the shives, and the amount of water is 10%. It has been established that with the proper selection of the forming parameters of the board, it is possible to avoid internal disintegration of the structure due to the water vapor pressure, increase the bending strength, and ensure uniform sintering of the board throughout the entire volume. It was found that additional processing of hemp shives can increase bending strength by more than 40%. Furthermore, during the processing of shives by chemical means, soluble substances are washed out, which reduces the density and thermal conductivity of the shives. Selection of a rational level of compression allowed us to increase the bending strength of the boards by 40%. The assessment of all factors made it possible to obtain boards with a bending strength of 40 MPa. The additives used made it possible to reduce the water absorption of the boards up to 16 times and obtain non-flammable boards. The thermal conductivity of the resulting boards varied from 0.07 to 0.095 W/(m·K). The analysis of macrostructure and microstructure allowed us to evaluate the process of the formation of bonds between hemp shives.
https://pubmed.ncbi.nlm.nih.gov/37512277/?utm_source=Chrome&utm_medium=rss&utm_campaign=pubmed-2&utm_content=1NqsX9BbHlDygQ8TcgAlJilHgPpiuKQtyIr–a3-xbLzPoB9xM&fc=20220928170152&ff=20230729190550&v=2.17.9.post6+86293ac July 29, 2023 10:00 am